Back-side illuminated image sensor
US10892292B2 · kind B2 · utility
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12Claims
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Key dates
| Filing date | Apr 17, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Jul 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
Abstract
A back-side illuminated image sensor includes memory regions formed in a semiconductor wafer. Each memory region is located between two opaque walls which extend into the semiconductor wafer. An opaque screen is arranged at the rear surface of the memory region and in electrical contact with the opaque walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.