Light-emitting device package including a lead frame
US10892391B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2019 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Aug 26, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting device package includes a lead frame, a light-emitting device chip, a molding structure, and a plurality of slots. The lead frame includes a first lead and a second lead including metal and spaced apart from each other. The light-emitting device chip is mounted on a first area of the lead frame, which includes a part of the first lead and a part of the second lead. The molding structure includes an outer barrier surrounding an outside of the lead frame and an inner barrier. The plurality of slots are formed in each of the first lead and the second lead. The inner barrier divides the lead from into the first area and a second area. The inner barrier fills between the first lead in the second lead. The second area is located outside of the first area. The plurality of slots are filled by the molding structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.