Thin-film connectors for data acquisition system
US10892573B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2020 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Jan 6, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/12
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present disclosure relates to data acquisition, and in particular to thin film connectors between a lead assembly and a data acquisition system. Particularly, aspects of the present disclosure are directed to a connector that includes a button having a housing and conductive pins extending from a proximal end of the housing through a base plate into a cavity on a distal end of the housing. The connector further includes a thin-film adapter having: (i) a supporting structure, (ii) bond pads formed on the supporting structure, (iii) a cable having conductive traces electrically connected to the bond pads, and (iv) feedthroughs that pass through the supporting structure and are electrically connected with the bond pads. Each conductive pin extends through a feedthrough, and each conductive pin is in electrical connection with one or more conductive traces via each bond pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.