Potted printed circuit board module and methods thereof
US10893604B1 · kind B1 · utility
0Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2020 |
| Grant date | Jan 12, 2021 |
| Priority date | — |
| Expiry date | Mar 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board assembly for retrofitting a circuit board on a power drive unit (PDU) may comprise an enclosure, a circuit board disposed in the enclosure, and a potting component disposed in the enclosure. The circuit board assembly may further comprise a dielectric sheet and a backing sheet. The dielectric sheet may be disposed between the backing sheet and the printed circuit board assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.