Patent · US Active

Printed circuit board composite and method for producing same

US10893615B2 · kind B2 · utility

4Cited by

9References

13Claims

0Family size

Assignee

CPT Zwei GmbH · DE

Inventors

Juergen Rietsch · Wendelstein, DE
Andreas Plach · Forchheim, DE
Andreas Albert · Höchstadt an der Aisch, DE
Mathias Strecker · Crailsheim, DE
Hassene Bel Haj Said · Nuremberg, DE
Johannes Bock · Kirchensittenbach, DE
Thengis Greifenstein · Nuremberg, DE

Key dates

Filing date	Dec 8, 2017
Grant date	Jan 12, 2021
Priority date	—
Expiry date	Dec 8, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/167
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A printed circuit board composite and a method for producing same. In the method for producing the printed circuit board composite, a first printed circuit board, in particular a sensor carrier printed circuit board, is connected in a form-fitting manner to a second printed circuit board, in particular a supporting printed circuit board. There is also described a printed circuit board composite.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.