2D multi-layer thickness measurement
US10893796B2 · kind B2 · utility
2Cited by
6References
21Claims
0Family size
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Key dates
| Filing date | Jan 21, 2019 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Jul 20, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30041
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method for measuring layer thicknesses of a multi-layer structure includes generating first and second 2D images of the structure, each image being generated by measuring an intensity of a reflection of incident lights, from different discrete narrow spectral bands, on the structure. Thicknesses for at least one layer of the structure are then determined based on the measured reflection intensities at those locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.