Method of manufacturing a liquid ejection head
US10894409B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 7, 2018 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Nov 19, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14467
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Provided is a method of manufacturing a liquid ejection head, which is capable of patterning a dry film while suppressing deformation of the dry film caused by a pressure. The method of manufacturing a liquid ejection head includes: preparing a substrate including an ejection orifice member on a first surface; forming, on an ejection orifice surface of the ejection orifice member, a protection film having communicating holes for allowing ejection orifices to communicate to outside; closing an opening of a supply port on a second surface on a side opposite to the first surface of the substrate with a dry film; and patterning the dry film by irradiating the dry film with light under a state in which the protection film is formed on the ejection orifice surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.