Attachment mechanism for tire-mounted sensors
US10894451B2 · kind B2 · utility
0Cited by
15References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2016 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Jun 11, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D2030/0072
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An assembly for mounting an electronics package to a tire includes an electronics package, a mount with a peripheral flange, and an attachment patch. The electronics package is connected to the mount, which is in contact with the tire. The attachment patch is connected to the mount and includes a central opening that is smaller than the peripheral flange. The attachment patch is further affixed to the tire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.