Bonding dissimilar ceramic components
US10894747B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2018 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Jan 10, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B2237/72
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.