Composition for removing silicone resins and method of thinning substrate by using the same
US10894935B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 18, 2018 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Aug 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Compositions for removing silicone resins and methods of thinning a substrate by using the same, as well as related methods, apparatus and systems for facilitating the removal of silicone resins are provided. The compositions for removing silicone resins, may include a heterocyclic solvent and an alkyl ammonium fluoride salt represented by a formula, (R)4N+F−, wherein R is a C1 to C4 linear alkyl group. Silicone resins may be effectively removed by using the compositions since the compositions exhibit an excellent decomposition rate with respect to the silicone resins that remain on a semiconductor substrate in a process of backside grinding of the semiconductor substrate, backside electrode formation, or the like.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.