Patent · US Active

Metallic structure

US10895006B2 · kind B2 · utility

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15Claims

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Assignee

CITY UNIVERSITY OF HONG KONG · CN

Inventors

Jian Lu · Kowloon, CN
Ge Wu · Beijing, CN

Key dates

Filing date	Nov 8, 2016
Grant date	Jan 19, 2021
Priority date	—
Expiry date	Jul 4, 2038

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/12993
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

A metallic structure includes a first plurality of metal particles arranged in an amorphous structure; a second plurality of metal particles arranged in a crystalline structure having at least two grain sizes, wherein the crystalline structure is arranged to receive the amorphous structure deposited thereon; wherein the grain size is arranged in a gradient structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.