Integrated laser transceiver
US10895684B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Jun 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/021
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method, and apparatus provided thereby, includes providing a substrate and placing an integrated laser on the substrate. A first cladding layer surrounds the integrated laser and includes a laser optical coupler aligned with an output of the laser. The laser optical coupler includes silicon and the laser includes a III-V compound semiconductor. The output of the laser is spaced apart from the laser optical coupler by a gap of less than or equal to 500 nanometers. An optical waveguide is positioned on the first cladding layer and in optical communication with the laser optical coupler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.