Patent · US Active

Power semiconductor chip module

US10896864B2 · kind B2 · utility

1Cited by

4References

12Claims

0Family size

Assignee

HS Elektronik Systeme GmbH · DE

Inventors

Richard Sinning · Schnelldorf, DE
Bernd Loefflad · Nördlingen, DE
Markus Greither · Augsburg, DE
Peter Brantl · Fremdingen, DE
Josef Maier · Eichstätt, DE
Rainer Seidel · Berlin, DE

Key dates

Filing date	Apr 27, 2018
Grant date	Jan 19, 2021
Priority date	—
Expiry date	Apr 27, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention relates to a power semiconductor chip module, comprising a substrate having a top side and a bottom side; at least one first power semiconductor device attached to the top side of the substrate; at least one first conductive structure thermally and electrically connecting the first power semiconductor device to the top side of the substrate; at least one second power semiconductor device attached to the bottom side of the substrate; and at least one second conductive structure connecting the second power semiconductor device to the bottom side of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.