LED display module and method of making thereof
US10896897B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2019 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Apr 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/84
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An LED display module includes an LED package having one or more layers of molding compound and containing an array of LED chips disposed therein, a plurality of conductive pads disposed on a surface of the LED package away from the array of LED chips, a network of conductive tracks connecting the array of LED chips with each other, and a plurality of conductive paths connecting the plurality of conductive pads and the network of conductive tracks. The network of conductive tracks includes a first layer of conductive tracks connecting the array of LED chips with each other, and a second layer of conductive tracks disposed substantially between the first layer of conductive tracks and the plurality of conductive pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.