Two layer microphone protection
US10897669B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2018 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Aug 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2410/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Aspects of the present disclosure provide multi-layer microphone protection for any apparatus that captures sound. The apparatus includes an enclosure defining a first cavity. A microphone element is coupled to the first cavity. The microphone element comprises a microphone sensor and a microphone cavity. A first, outer protective layer is disposed at an outer end of the first cavity, closer to the external environment. A second, inner protective layer is disposed between an inner end of the first cavity and the microphone element. The second, inner protective layer may protect the microphone sensor from particles or liquids that may have passed through the first protective layer. The first and second layers may have different acoustic properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.