Electronic device comprising an electronic component mounted on a support substrate and assembly method
US10897822B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2020 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | Mar 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.