Cooling system for high density heat loads
US10897838B2 · kind B2 · utility
0Cited by
13References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2019 |
| Grant date | Jan 19, 2021 |
| Priority date | — |
| Expiry date | May 7, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20836
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system including a primary cooling module supplying refrigerant to a circuit including a thermal load. A secondary cooling module provides a supplemental flow of refrigerant to the circuit upon detection of a deficiency of the primary cooling module. A valve is disposed between the primary: module and the circuit to prevent refrigerant flow between the primary cooling module in the circuit. The secondary cooling module transactions from a standby mode of operation to an online mode of operation and the primary cooling module is deactivated in response to detection of the deficiency of the primary cooling module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.