Abutment, laser cutting device and control method thereof
US10898974B2 · kind B2 · utility
0Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2017 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Nov 1, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K37/0408
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to the field of display technologies, and provides an abutment, a laser cutting device and a control method thereof, so as to improve the yield rate and prolong the service life of a product. Specifically, the abutment comprises a carrying region. The carrying region is used for placing a component to be cut thereon, and comprises an adsorbing region and a cutting region. Furthermore, the adsorbing region is provided with adsorbing holes for adsorbing the component to be cut. Besides, the cutting region extends from a side of the carrying region to an opposite side thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.