Multi-layer stamp
US10899067B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Jun 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/018
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A stamp for micro-transfer printing includes a support having a support stiffness and a support coefficient of thermal expansion (CTE). A pedestal layer is formed on the support, the pedestal layer having a pedestal layer stiffness that is less than the support stiffness and a pedestal layer coefficient of thermal expansion (CTE) that is different from the support coefficient of thermal expansion (CTE). A stamp layer is formed on the pedestal layer, the stamp layer having a body and one or more protrusions extending from the body in a direction away from the pedestal layer. The stamp layer has a stamp layer stiffness that is less than the support stiffness and a stamp layer coefficient of thermal expansion that is different from the support coefficient of thermal expansion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.