Bonded nutplate rapid cure system
US10899083B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Oct 18, 2038 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B37/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Systems for positioning and bonding a nutplate to a substrate having an aperture include a nutplate engagement fixture and a temperature sensor retention fixture. The nutplate engagement fixture includes a rigid tube and an elastomeric tube engaged with the rigid tube, the elastomeric tube having an elongated tube sized to provide a friction fit with the aperture and retain the elastomeric tube within the aperture. The rigid tube is operable to engage the nutplate at one end and the elastomeric tube is configured to anchor the nutplate engagement fixture at the aperture and secure the nutplate in contact with the substrate. The temperature sensor retention fixture includes a fixture body sized and configured to engage with the nutplate and at least one passageway within the fixture body sized and configured to allow a temperature sensor to be inserted or embedded therein with an end proximal a surface of the nutplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.