Process for transferring microstructures to a final substrate
US10899120B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Nov 23, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldOther consumer goods
- WIPO sectorOther fields
Abstract
A process for transferring microstructures to a flexible or rigid final substrate that offers advantages in both speed and precision is provided. The inventive process involves subjecting a transfer film in a continuous roll-to-roll process to the following operations: either forming microstructures on, or transferring microstructures to a surface of the transfer film; and then transferring the microstructures from the transfer film onto a surface of the final substrate. The microstructures are single or multi-layer structures that are made up of: voids in a substantially planar surface, the voids optionally filled or coated with another material; raised areas in a substantially planar surface; or combinations thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.