Liquid discharge head substrate, method of manufacturing the same, liquid discharge head, and liquid discharge apparatus
US10899129B2 · kind B2 · utility
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3References
16Claims
0Family size
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Key dates
| Filing date | Jan 25, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Jan 25, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/18
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.