Micromechanical z-inertial sensor
US10899603B2 · kind B2 · utility
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Key dates
| Filing date | Nov 2, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | May 28, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0831
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micromechanical z-inertial sensor, having a movable MEMS structure developed in a micromechanical function layer; a torsion spring connected to the movable MEMS structure; and a spring device connected to the torsion spring, the spring device being developed to hamper a deflection of the torsion spring orthogonal to a sensing direction of the MEMS structure in a defined manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.