Polyimide precursor solution and method for producing same
US10899886B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 11, 2017 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Dec 24, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2379/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a polyimide film which, by having a fluorine structure adopted into a rigid polyamide chain structure, exhibits not only superb heat resistance but also enhanced optical properties. Additionally, the polyimide according to the present invention, by having the particular structure, exhibits excellent transparency, heat-resistance, mechanical strength and flexibility, and thus can be utilized in a variety of functions such as an element substrate, display cover substrate, optical film, integrated circuit (IC) package, adhesive film, multi-layered flexible printed circuit (FPC), tape, touch panel, and protective film for optical disks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.