Curable composition

US10899926B2 · kind B2 · utility

Assignee

• SIKA TECHNOLOGY AG · CH

Inventors

• Edis Kasemi · Zürich, CH
• Andreas Kramer · Zürich, CH
• Ursula Stadelmann · Zürich, CH
• Urs Burckhardt · Zürich, CH
• Hans Häberle · Rielasingen-Worblingen, DE
• Steffen Kelch · Schlieren, CH

Key dates

• Filing date: Feb 14, 2017
• Grant date: Jan 26, 2021
• Expiry date: Feb 14, 2037

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L2312/08
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A composition including at least one polymer containing silane groups, at least one epoxy resin, and at least one amine of the formula (I). The composition is low in odor, low in toxicity, and highly workable. It enables low-emission products which cure rapidly at ambient temperature to form macroscopically homogeneous films or bodies having good mechanical properties, high thermal stability and good adhesion properties, the mechanical properties being able to be adjusted from very elastic through to tough elastic. The composition is especially suitable as adhesive and/or sealant or coating.