Interlayer printing process
US10899940B2 · kind B2 · utility
1Cited by
1References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2017 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Dec 19, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed herein as a printing method and system which includes providing a substrate and depositing an interlayer composition including a polymer selected from the group of epoxy resins, polyvinyl phenols and poly(melamine-co-formaldehyde) and an interlayer composition solvent on the substrate. The interlayer composition is cured to form cured interlayer. A conductive metal ink composition is deposited on the cured interlayer and the conductive metal ink composition is cured to form a solid metal trace on the cured interlayer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.