Device for heat transfer
US10900446B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Feb 12, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T10/12
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Device for heat transfer and method for making it, the device having a housing with a heat exchanger disposed within and completely enclosed by the housing having a receiving element and cover element integrated within receiving element. First fluid flows through heat exchanger to be cooled; another fluid flows around heat exchanger. Heat transfer elements are shaped as a plate of a first jacket element and a second jacket element as well as a fin element; each includes a throughflow sector for inflow and outflow of first fluid. Each throughflow sector is developed on a front face of heat transfer element. Fin element has a lesser dimension in a longitudinal direction than jacket elements and is disposed therebetween such that in the proximity of a second front face, located distally to first front face, a free region is developed for deflecting direction of flow of first fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.