System and method for electronic die inking after automatic visual defect inspection
US10902576B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2017 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Dec 5, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of providing a semiconductor device and a computer-readable medium having instructions for performing the method are disclosed. The method includes receiving a first wafer defect map that defines comparison regions and identifies visual defect locations for a wafer. A format of the comparison regions is determined, with the format chosen from a group including die-to-die, partial-shot-to-partial-shot and full-shot-to-full-shot. If the comparison format is not die-to-die, mapping information is received that provides die locations within the comparison regions. A wafer layout map is provided that identifies die locations within the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.