Multilayer electronic component and method of manufacturing the same
US10903011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Jul 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/248
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer electronic component includes: a capacitor body including first and second internal electrodes disposed to be alternately exposed through opposite surfaces, respectively, with respective dielectric layers interposed therebetween; first and second thin film layers including at least one of titanium nitride (TiN), ruthenium (Ru), platinum (Pt), iridium (Ir), or titanium (Ti), disposed on the surfaces of the capacitor body, and connected to the first and second internal electrodes, respectively; and first and second external electrodes formed on the first and second thin film layers. A thickness of the first or second thin film layer is less than or equal to 60 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.