Electrode connection structure, lead frame, and method for forming electrode connection structure
US10903146B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 7, 2017 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Mar 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
[Problem] To provide an electrode connection structure and the like in which a plurality of elongated leads are arranged in parallel and a longitudinal side surface of each lead is connected to an electrode by plating treatment with high quality.[Solution] An electrode connection structure in which a semiconductor chip 12 electrode and/or a substrate electrode is connected to a plurality of elongated leads 11 of a lead frame 10 by plating. The plurality of elongated leads 11 of the lead frame 10 are arranged in parallel, and a longitudinal side surface of each lead 11 is connected to the semiconductor chip 12 electrode and/or the substrate electrode by plating. At a connection portion of a first connection surface 13 of the semiconductor chip 12 electrode and/or the substrate electrode, the first connection surface 13 being connected to the leads 11, and a second connection surface 14 in the longitudinal side surface of each lead 11, the second connection surface 14 being connected to the first connection surface 13, a distance between the first connection surface 13 and the second connection surface 14 continuously increases from an edge portion 15 of the second connection surface…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.