Large structure monitoring with a substrate-free flexible sensor system
US10903415B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 4, 2019 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Aug 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1131
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of additively-manufacturing a flexible sensor system having a lattice topology includes a number of electrical interconnects, each having one or more electrically-conductive layers alternately sandwiched between two or more dielectric layers, and two or more sensors defining a sensor array, each sensor located at an intersection of and electrically connected to the interconnects on the lattice topology and electrically-connected to the interconnects. Each of the electrically-conductive layers includes a cured material base and silver, copper, aluminum, gold, platinum, ruthenium, carbon, and/or alloys thereof, and each of the dielectric layers includes a cured material base. The additively-manufactured flexible sensor system is configured to be installed on the surface of an asset for the monitoring of that asset.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.