Packaging and thermalization of cryogenic dispersive resistive hybrid attenuators for quantum microwave circuits
US10903541B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2020 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Feb 11, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2007/013
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A hybrid microwave attenuator is constructed by forming a circuit and a housing. The circuit has two ports, a resistive component configured to attenuate some frequencies in an input signal (transmitted signal), and a dispersive component configured to attenuate some frequencies within a frequency range. The resistive component and the dispersive component are arranged in a series configuration relative to one another between the two ports of the circuit. The housing includes a closable structure in which the circuit is positioned, the structure being formed of a material that exhibits at least a threshold level of thermal conductivity, where the threshold level of thermal conductivity is achieved at a cryogenic temperature range in which a quantum computing circuit operates. The housing further includes a pair of microwave connectors, the pair of connectors being thermally coupled to the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.