Patent · US Active

Connecting arrangement and corresponding method for mounting an electronic component on a printed circuit board

US10905010B2 · kind B2 · utility

0Cited by
5References
10Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 31, 2018
Grant dateJan 26, 2021
Priority date
Expiry dateJan 7, 2039

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY02P70/50
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A connecting arrangement includes an electronic component and a printed circuit board, and a method includes establishing a solder connection between the component and circuit board. The component has a housing with a support area, and a contact element with a first contact area running parallel to the support area of the housing, a second contact area at a prespecified angle relative to the first contact area, and a rounded transition region formed between the first and second contact areas. The circuit board has a first surface with a soldering area including a constriction, a first section, and a second section connected to the first section via the constriction. The transition region is in a region of the constriction. The second contact area is connected to the second section via a solder connection. The support area is at an angle relative to the first surface corresponding to the prespecified angle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.