Printed wiring board and method for manufacturing the same
US10905013B2 · kind B2 · utility
0Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 2019 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | May 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1453
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a wiring base body of a printed wiring board, a conductive post including a wiring portion and a wiring are embedded in an insulating resin film. Therefore, even in a region in which a wiring portion is formed, the wiring base body is not increased in thickness. In addition, even in a region in which a wiring is formed, the wiring base body is not increased in thickness. Therefore, it is possible to obtain a printed wiring board having high flatness by stacking a plurality of wiring base bodies and constituting a printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.