Chip component having groove formed therein
US10905015B2 · kind B2 · utility
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1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2018 |
| Grant date | Jan 26, 2021 |
| Priority date | — |
| Expiry date | Feb 27, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.