Method for manufacturing device temperature control device and method for filling working fluid
US10906141B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2019 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Apr 10, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23P2700/09
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a device temperature controller includes filling an inside of a circuit with working fluid by connecting a filling port of the circuit to a container that stores gas phase working fluid. The circuit constitutes a thermosiphon heat pipe and allows the working fluid to circulate in the circuit. In the filling, the working fluid inside the circuit is cooled by a cooling source. An inside temperature of the circuit is decreased to be lower than an inside temperature of the container, and thereby an inside pressure of the circuit is decreased to be lower than an inside pressure of the container.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.