Preparation of modified epoxy acrylates and solder resist containing modified epoxy acrylates
US10907009B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2018 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Feb 11, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/031
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention discloses modified epoxy acrylates and the solder resist containing the epoxy modified acrylates, belonging to the synthetic resin field. In this invention, modified epoxy acrylates are prepared by introducing long fatty hydrocarbon chain as the branched chain into the carboxylated epoxy acrylates. The as-prepared solder resist containing this modified epoxy acrylates maintains the excellent property of photosensitive solder resist such as good adhesion, hardness, solvent resistance and weather resistance which facilities sensitivity and alkaline development during exposure simultaneously. This has led to good water resistance, electrical insulation of the cured products. Furthermore, the cured product also shows good flexibility which improves its application in photosensitive imaging ink materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.