Method and apparatus for less destructive evaluation and monitoring of a structure
US10908036B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2014 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Sep 19, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01M5/0066
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Methods and apparatuses for monitoring a first structure at least partially according to properties of a second structure. One such method comprises determining a first relationship between a first variable and a second variable, wherein the first variable represents sizes of actual damage to the second structure, and the second variable represents sizes of simulated damage on the second structure; determining a second relationship between a third variable and a fourth variable, wherein the third variable represents sizes of simulated damage on the first structure, and the fourth variable represents values of a damage index determined for the simulated damage on the first structure; and determining an estimate of damage to the first structure according to the first and second relationships.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.