Removable electronics device for pre-fabricated sensor assemblies
US10908732B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2019 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Aug 26, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06N20/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A removable electronics device for pre-fabricated sensor assemblies of interactive objects is provided. The removable electronics device includes one or more processors, a first communication interface configured to communicatively couple with one or more remote computing devices, and a second communication interface configured to communicatively couple with a plurality of pre-fabricated sensor assemblies having touch sensors with different sensor layouts. The removable electronics module can analyze, in response to being physically coupled to a first pre-fabricated sensor assembly, first touch data to detect one or more pre-defined motions based on one or more first pre-defined parameters associated with the first touch sensor. The removable electronics module can analyze, in response to being physically coupled to a second pre-fabricated sensor assembly, second touch data to detect the one or more pre-defined motions based on one or more second pre-defined parameters associated with the second touch sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.