Flip chip bonding method
US10910339B2 · kind B2 · utility
0Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2019 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Aug 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A flip chip bonding method includes obtaining a die including a first substrate and an adhesive layer on the first substrate; bonding the die to a second substrate different from the first substrate; and curing the adhesive layer. The curing the adhesive layer includes heating the second substrate to melt the adhesive layer, and providing the adhesive layer and the second substrate with air having pressure greater than atmospheric pressure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.