Electronic device and rigid-flexible substrate module
US10912204B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 5, 2018 |
| Grant date | Feb 2, 2021 |
| Priority date | — |
| Expiry date | Mar 16, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device and rigid-flexible substrate module includes a rigid-flexible substrate having a first region and a second region more flexible than the first region and having a first laterally extended region extending in a first lateral direction further than the first region, an integrated circuit (IC) disposed in a position lower than a position of the first region of the rigid-flexible substrate, a signal line electrically connected to the IC and extending to a lateral end of the second region of the rigid-flexible substrate, and a first heat dissipation ground layer including a first portion that overlaps the first region when viewed in a vertical direction, and a second portion different from the portion that overlaps the first laterally extended region when viewed in a vertical direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.