Bonding device for flexible panel and method for bonding flexible panel
US10913252B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 22, 2018 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Oct 29, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG09F9/301
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present disclosure provides a bonding device for a flexible panel including: a transport element, a vacuum chamber, a cover jig, and a bonding jig; wherein the transport element is configured to move the flexible panel into the vacuum chamber or move the flexible panel out of the vacuum chamber; wherein both the cover jig and the bonding jig are disposed in the vacuum chamber, the cover jig is opposite to the bonding jig, and the cover jig is configured to secure thereon a cover plate to be bonded; and wherein the bonding jig has a curved hump protruding toward the cover jig, and the hump is configured to raise the flexible plate up to the cover plate to bond the cover plate with the flexible panel when the transport element transports the flexible plate to a location below the cover plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.