Array-type electrode, digital printing mold and method for manufacturing array-type electrode
US10913301B2 · kind B2 · utility
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2References
12Claims
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Key dates
| Filing date | Dec 26, 2017 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Nov 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0117
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.