Ultrasensitive thermo-mechanical bolometer
US10914637B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2019 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Aug 7, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/40
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A thermo-mechanical bolometer includes a substrate and a sensing component mounted on the substrate. The sensing element comprises (a) at least one thermal-actuation component mounted in parallel with the substrate and (b) a strain sensor mounted on the at least one layer of thermal-actuation component. The at least one thermal-actuation component alone or in combination (a) absorbs electromagnetic waves and converts energy from absorbed electromagnetic waves into a change in temperature and (b) converts the change in temperature into a deformation of the at least one layer. The strain sensor comprises a layer of fragments with a gap space between the fragments, wherein the strain sensor senses the deformation or mechanical movement and exhibits a change in electrical resistance in response to the sensed deformation or mechanical movement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.