Method for manufacturing pattern for electronic devices, and fiber-type electronic device comprising the pattern for electronic devices
US10915024B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2018 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Nov 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0272
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A fiber-type electronic device comprising a pattern for electronic devices stacked on a fiber filament substrate is provided. It is possible to manufacture an electronic device directly on a fiber filament substrate by applying the pattern for electronic devices. Thus, it can be widely used for wearable devices and the like. The pattern for electronic devices is manufactured by a method for forming a pattern for electronic devices comprising an exposure process using a maskless exposure apparatus. Thus, it is possible to manufacture a pattern for electronic devices on a fiber filament substrate through a continuous process and thus to increase the process efficiency.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.