Scalable high-performance embedded computing systems
US10915152B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2017 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | Dec 25, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F13/36
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for scalable high-performance embedded computing architectures. According to an embodiment, a scalable high-performance embedded computing system increases computational capability within the restrictive size, weight, and power constraints of systems such as the external pod payloads of unmanned aircraft systems, among many other possible systems. The core computer capability can be placed in various environments, and according to one embodiment utilizes a flight-certified aeronautics pod that is scalable in length. The scalable HPEC system can be connected to external data sources, or the nose and tail can be made of Radio Frequency transparent material, enabling the use of various RF sensing technologies within the same aeronautics enclosure. According to an embodiment, a lightweight, thermally-efficient conduction cooled chassis supports the required board and interface hardware.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.