Three-dimensional antenna array module
US10916861B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2017 |
| Grant date | Feb 9, 2021 |
| Priority date | — |
| Expiry date | May 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q21/0025
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.