Method of manufacturing band-shaped metal wire member including bonded portion
US10919079B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2016 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Oct 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/048
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention seeks to enable a band-shaped metal wire member to be stably accommodated within a die. A die is prepared that includes a bottom die provided with a depression and a top die provided with a projection that can be arranged within the depression so as to close off a space above the depression. An inner surface of the depression includes a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward. The central die surface is formed as a flat surface or as a surface that curves more gently than the pair of curved guide die surfaces. A bonding process portion of a band-shaped metal wire member is folded in two and arranged within the depression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.