Resin component, and molding method and molding device for same
US10919390B2 · kind B2 · utility
1Cited by
1References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2017 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Sep 20, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3038
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An instrument panel (10) is formed by bonding a base material portion (20) composed of a base material M1 and a different material portion (30) composed of a different material M2. The different material portion (30) is infiltrated into the base material portion (20) and the infiltration portion (33) has a plurality of intermittent recessed portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.