Resin composition and use thereof
US10920034B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 13, 2017 |
| Grant date | Feb 16, 2021 |
| Priority date | — |
| Expiry date | Jun 13, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L23/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a resin composition from which a heat dissipation sheet having high effect to suppress temperature elevation due to heat generated by electronic parts (elements) can be obtained. Specifically provided is a resin composition containing: a polymer (1) whose enthalpy of fusion observed within a temperature range of 10° C. or higher and lower than 60° C. in differential scanning calorimetry is 30 J/g or more; and a thermally conductive material (3) whose thermal conductivity is 1 W/(m·K) or higher, wherein the content of the thermally conductive material (3) is 1 part by weight or more and 80 parts by weight or less, with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.